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Devcon 5-Minute Epoxy Gel

Fast-curing, thixotropic, non-migrating adhesive designed for filling gaps and bonding rough or smooth surfaces. Disappearing blue coloring tells you when the product is thoroughly mixed for easy use.

Features:
  • High tensile strength (2,500 psi)
  • Good solvent resistance to gas, oil and other solvents
  • Non sag which makes it ideal for use on vertical surfaces
  • Excellent gap filling qualities without tremendous shrinkage
  • Fast curing for bond tags on machinery and equipment

Minta Penawaran

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